The world’s first successful high-speed data transmission with 300 GHz beamforming and instantaneous ultra-high capacity data transmission
A new phased array transmitter module for 6G wireless communication has been developed by NTT Corporation (Headquarters: Chiyoda-ku, Tokyo; President and CEO: Akira Shimada; “NTT”) and Professor Kenichi Okada and researchers from the Department of Electrical and Electronic Engineering. Engineering, School of Engineering, Tokyo Institute of Technology (Meguro-ku, Tokyo; President: Kazuya Masu; “Tokyo Tech”)
They succeeded in transmitting the world’s first wireless data beam in the 300 GHz band. This technology will allow instantaneous transmission of very high capacity data to mobile receivers.
Details of this groundbreaking technology were announced at the IEEE MTT-S International Microwave Symposium 2023 (IMS2023) held in bustling San Diego, California, USA.
Taking place from June 11, 2023, this prestigious event brings together experts, researchers and industry experts from around the world to showcase the latest advances in microwave technology and wireless.
Beam imaging using phased array wireless equipment. Compare the transmissions reported previously with these cognitive and beamforming wireless devices.
In the sixth generation of wireless communications (6G), the use of the 300 GHz band promises to achieve extremely fast wireless connections.
The wide frequency range available in this band has a significant advantage. However, a major challenge comes in the form of significant path loss as the signal travels through space. To solve this problem, researchers are actively exploring Beamforming technology.
Beamforming technology concentrates and directs radio energy to the intended receiving device. In the context of 5G wireless systems using radio waves in the 28 GHz and 39 GHz bands, beamforming has been successfully implemented using CMOS integrated circuits (ICs). However, when it comes to the 300 GHz band, the CMOS-IC alone will lack the required output power*.
To overcome this limitation, a worldwide effort is underway to combine CMOS-ICs with complex III-V ICs , which have high output power.
This combination is intended to achieve an efficient beamforming in the 300 GHz band. However, several obstacles impede progress, such as large power losses occurring in the III-V composite IC and when connecting between the III-V composite IC and the CMOS IC. Tokyo Tech successfully manufactures large-scale CMOS-IC
Tokyo Tech has taken an important step by creating a highly miniature CMOS-IC that integrates frequency conversion and control circuits.
Building on this success, NTT and Tokyo Tech have collaborated to develop a compact transmitter module consisting of a 4-element phased array. This module integrates the aforementioned CMOS-IC and InP-IC on a single PCB.
NTT has also developed an indium phosphide integrated circuit (InP-IC) that combines NTT’s proprietary high-performance power amplifier and antenna circuitry. This feat is made possible by NTT’s proprietary Indium Phosphide Bipolar Transistor (InP HBT) technology. 300 GHz . high efficiency power amplifier circuit design
NTT and Tokyo Tech have also collaborated to develop a power amplifier circuit that excels in delivering high output power in the 300 GHz frequency band.
The power amplifier circuit uses a low-loss power combiner to combine the output electrical power of multiple amplifier elements, achieving high output power.
This circuit plays an important role in amplifying the signals generated by the CMOS-IC and transmitting the received radio waves to the receiving device through an antenna integrated on the same chip.
By achieving this feat, NTT and Tokyo Tech were able to provide the high output power needed to facilitate high-speed data transmission to the receiving device. Mounting the waveguide module Traditionally, connecting different ICs for the 300 GHz band involved mounting each IC on a waveguide module, which were then interconnected. However, this method loses power when radio waves pass through the waveguides.
To solve this problem, NTT and Tokyo Tech succeeded in solving the problem through the flip-chip linkage of the CMOS-IC and InP-IC, connecting them using lth-sized metal colliders. several tens of micrometers.
By applying this conditioning method, the loss of connection is greatly reduced, improving efficiency. In addition, this innovative method achieves high output power, marking an important breakthrough in the field.
Future research on 6G networks
6G networks should deploy short-range mobile communication devices. NTT and Tokyo Tech have developed promising technology to expand the application of these devices, including interactive kiosks and femtocells.
The technology they developed represents a one-way beamforming. Currently, NTT and Tokyo Tech are focusing on introducing a two-way beam format using 2D grating and increasing the communication distance by adding more gratings.
At the same time, they are also actively involved in the development of receiver modules to meet the requirements of 6G applications and deploy wireless communication with ten times the transmission capacity of what is available.